双层铜金属薄膜纳米压痕机械性能的分子动力学模拟.pdfVIP

29 11 2008 11 Vol. 29 No. 11 Chinese Journal of Catalysis N ovember 2008 : ( 200 8) : 1122~ 1126 1 2 2 2 廖明亮, 翁盟雄 , 朱训鹏, 江幸蓉 ( 1 空军航空技术学院飞机工程学系, 台湾高雄 80424 ; 2 中山大学机械 机电工程学系纳米科技 科学中心, 台湾高雄 80424) : . , . . FCC ( 100) , ( 110) , . : ; ; ; : O643 : A Molecular Dynamics Simulation on the Nanoindentation Behavior of a Copper Bilayered Thin Film 1 2 2* 2 LIAO MingLiang , WENG MengHsiung , JU ShinPon , CHIANG HsingJung (1 Dep artment of A ircraf t Engineering, A ir Force Institute of Technology , Kaohsiung 80424, Tai an, China; 2 Dep artment of Mechanical and ElectroMechanical Engineering , Centerf or Nanoscience and Nanotechnology, Sun YatSen University , K aohsiung 80424, Tai an, China) Abstract: U nderstanding t he mechanical properties of mult ilayered metal thin film s is very important for their applications in nanoscale devices. N anoindentation is one of the w idely used tools for examining the mechanical properties of metal thin f ilm s. In the present study, molecular dynamics simulation w as employed to investig