化学镀非晶态Ni―P及Ni―Sn―P镀层在弱酸性介质中耐蚀性研究.docVIP

化学镀非晶态Ni―P及Ni―Sn―P镀层在弱酸性介质中耐蚀性研究 　　摘 要：以紫铜为基体，采用化学镀制备了非晶态Ni-P，Ni-Sn-P镀层.采用X射线衍射（XRD）、扫描电子显微镜（SEM）和X射线能谱（EDS）等对镀层的结构、微观形貌及元素组成进行分析.通过Tafel极化曲线、电化学阻抗谱（EIS）、开路电位监测及室内加速腐蚀试验，研究两种镀层在pH=5.5，wNaCl=3.5%，以及pH=5.5，wS=20%的土壤介质中的耐蚀性能.结果表明，化学镀非晶态Ni-P及Ni-Sn-P镀层的自腐蚀电流密度是裸铜的4.5%和1.2%，两种镀层在酸性腐蚀介质中具有比金属铜更好的耐蚀性，并且化学镀Ni-Sn-P镀层耐蚀性优于Ni-P镀层.两种镀层的自腐蚀电位均负于铜. 中国论文网 /4/view-7222124.htm 　　关键词：化学镀；铜接地线；弱酸性；土壤介质；耐蚀性 　　中图分类号：O69 文献标识码：A 　　Study of the Corrosion Resistance of Eletroless Amorphous 　　Ni-P and Ni-Sn-P Coatings in Weak Acidic Medium 　　ZHOU Hai-hui1， 2，ZHANG Cheng-ping1，2， FANG Chen-xu1，2， FENG Bing3， 　　XU Song3， LIAO Zuo-wei1，2， KUANG Ya-fei1，2 　　（1. State Key Laboratory of Chemo/Biosensing and Chemometrics ， Hunan Univ， Changsha， Hunan 410082， China； 　　2. College of Chemistry and Chemical Engineering， Hunan Univ， Changsha， Hunan 410082， China； 　　3. State Grid Hunan Electric Power Corporation Electric Power Research Institute， Changsha， Hunan 410007， China） 　　Abstract： Amorphous Ni-P and Ni-Sn-P coatings were prepared on pure copper substrates by electroless plating. The structure， surface morphology and composition of the as-plated coatings were characterized by X-ray diffraction （XRD）， scanning electron microscopy （SEM） and energy-dispersive analysis （EDS）. The corrosion resistance behaviors of the as-plated Ni-P and Ni-Sn-P coatings were investigated by Tafel polarization， electrochemical impedance spectroscopy （EIS）， open circuit potential and accelerating corrosion indoors in wNaCl=3.5% solution at pH 5.5 and in soil with a water content of wS=20% at pH 5.5. The results indicate that electroless amorphous Ni-P and Ni-Sn-p plating of the corrosion current density is 4.5% and 1.2% of the bare copper and the two coatings offer better corrosion resistance than copper in weak acidic corrosive medium， while Ni-Sn-P coating exhibits the best corrosion resistance. Besides， the two coatings have a negative shift of self-corrosion potential when compared with Cu substrate， showin