倒装芯片重点.pptxVIP

ETi倒装芯片介绍 倒装芯片技术 倒装芯片工艺流程 主要内容 LED应用及市场水平 二 一 倒装芯片工艺流程 工艺流程简介 三 一、LED应用 应用举例： Par Lamp Spot Light High Bay Street Light Offers： High luminance Directionality Reliability Lumen/$ Lumen/Package Indoor Applications： LED Lamps Accent and Track Commercial Industrial Outdoor Applications： Stree Tunnel Parking area Portable Lighting： Flashlight Bicycle lighting 一、LED应用及市场水平 一、LED应用 全球照明市场： The global lighting market is expected to grow at a CAGR of around 7-9% during 2010-2015, to around EUR 80 billion; Growth in global illumination market is driven by the LED revolution with rapid adoption o