毕业论文 晏爽.doc

摘要 作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。晶圆键合可以使得经过抛光的半导体晶圆在不使用粘结剂的情况下结合在一起。这种技术可以用于微电子、微机械、光电子等诸多领域。因此，深入研究晶圆键合的技术和应用的细节，对于推进晶圆键合在半导体产业中的应用具有重要的意义它为芯片提供了电通路。所以在设计芯片时可以引入垂直互联金属层，实现晶圆堆叠和先进封装技术，从而进一步减小芯片尺寸，降低成本。 关键词： Abstract As one of the newly-emerged enabling technologies,wafer direct bonding has been playing key roles in more and more fields.Without any kind of glue,wfer bonding technology is able to integrate two polished semiconductor wafers and thus be used widely in fields like micro-electronics micro-mechanics and opto-electronics.Researching deeply into detailed aspects of wafer bonding technologies and applications will help to promote its maturity in semiconductor industry.With rapid development for recent 20 years,wafer bonding has become the basic technology in MEMS (Micro-Electro-Mechanical System) packaging and an important tool in MEMS engineering field.WLP(Wafer Level Package),3-D Chip Stacking and SOI (Silicon-On-Insulator) are the three impetuses for the development of wafer bonding technology. Metallic bonding technology compared with other bonding technology, it provides electrical pathways for chips. So when designing chips can introduce vertical interconnect metal layer, realize wafer stack and advanced packaging technology, thus further decrease the size of chip, reduce the cost. This article obtains from the wafer metallic bonding mechanism of closing technique, based on the wafer bonding process analysis, summarizes the several factors affecting the quality of bonding (surface chemical properties, roughness, interface morphology, 3 d microstructure as well as the effects of temperature and humidity), and adopted the reliability experiment is verified; At the same time for graphical wafer metallic bonding process was made beneficial exploration and research. Key words：wafer metallic bonding MEMS process flow application 目录 1 绪论.…………………………………………………………………………………………4 晶圆键合概念……………………………………………………………………………4