Possible Applications for Green’s Functions in 可能的应用在绿色的功能.pptVIP

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Possible Applications for Green’s Functions in 可能的应用在绿色的功能.ppt

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Possible Applications for Green’s Functions in 可能的应用在绿色的功能

Possible Applications for Green’s Functions in Simulation Software Green’s Functions for Simulation Software Solution of 3-D Field Equations is now a standard part of the Industrial Design Process ANSYS Finite Element Code Solve for Strain and Stress fields Solve Poisson Equation for Temperature Fields Fluent or FlowTherm Finite Volume CFD Codes Solve Navier-Stokes for Fluid Velocity Fields PakSi-E Finite Element Code Many Other Examples Green’s Functions for Simulation Software Commercial Simulation Software is applied to very large, very detailed models Up to 1,000,000 Finite Elements in Thermal/Stress/Electrodynamic Analyses Up to 1,000,000 Finite Volumes in Computational Fluid Dynamic Analyses Solution must run overnight Green’s Functions for Simulation Software Green’s Functions for Simulation Software Iterative Solution of Poisson Equation for 106 Elements is just barely possible in 12 hrs The pressure is always on from designers for models with more detailed, realistic geometry Add more and more elements The solution must be available in the morning A Green’s function solution can be much faster than an iterative solution. Green’s Functions for Simulation Software One particular possibility for introduction of a Green’s Function solution - IC package Design Integrated Circuit (IC) package design requires analysis of inductance and capacitance of circuit nets in the package, as well as voltage wave travel time and wave shape distortion by cross-talk. Ideally this analysis would be done with a 3-D solution of Maxwell’s Equation. Currently, Finite Element Solutions are limited by the need for overnight solution Green’s Functions for Simulation Software Geometric Considerations IC Packages are a stackup of thin layers The layer materials alternate (conducting, non-conducting) Need 3-D Multi-Layer solutions Pan, Yang and Yuan have developed 3-D multi-layer solutions for stress-strain analysis for the Lanis program Green’s Functions for Simulation So