LCD技术介绍(ASTN DSTN).pdfVIP

Ne w C h a l l e n g e N e w C h a l l e n g e N e w T a r g e t N e w T a r g e t 2 1. LCD Configuration ITO Electrode Polyimide Liquid Crystal Molecule Sealant Adhesive Polyimide Glass Substrate ITO Electrode ITO Electrode Glass Substrate Front Polarizer Rear Polarizer Conductive Silver dot/ Conductive bar LCD Configuration Ne w C h a l l e n g e N e w C h a l l e n g e N e w T a r g e t N e w T a r g e t 3 2. LCD ComponentsIngredient (Material Name) (Main Ingredient) ITO Indium-Tin Oxide Glass Liquid Crystal Polarizer Spacer End seal PI Sealant Metal Pin 1 (SiO2) 70.8%) 2 Na2O 13.9% 3 K2O 0.4%) 4 CaO 8.2%) 5 MgO 4.4%) 6 Al2O3 1.9%) 7 SO3 0.3%) 8 In2O3 0.09%) 9 SnO2 0.01%) 1 C22H25N 20% 2 C20H22O 35% 3 C21H24F24 25% 4 C29H32O2 20% 1 (TAC) 45%) 2 PET 18% 3 PC 17%) 4 PSA 14%) 5 PVA 6%) Acylic resin micro spheres 1 Urethane acrylate(35%) 2 Epoxy acrylate(35%) 3 Acrylic monomer(27%) 4 Solvent 3% 1 Polyimide 7% NMP+DMA+BC 93% 1 Modified Epoxy Rosin Compounds 2 Latern Curative 3 Filler and additives 4 Solvent 1 Sn 59% 2 Others 41% Ne w C h a l l e n g e N e w C h a l l e n g e N e w T a r g e t N e w T a r g e t 4 3.1 LCD Process Flow- Front-end Process Start Insert Cassette 1st Cleaning Developing Photoresist Curing Exposure Photoresist Coating Curing Etching Stripping Final Cleaning Hard coat Printing HC Curing PI Printing PI Curing Rubbing Frit Screen Printing Dot Screen Printing Spacer Spraying Assembling Main Curing Ne w C h a l l e n g e N e w C h a l l e n g e N e w T a r g e t N e w T a r g e t 5 3.2 LCD process Flow back-end process Start Cell scribing Cell Breaking Press End Sealing End SealingLC Filling Cleaning Baking Functional Test Visual Inspecting Outgoing Inspection Packing Polarizer Assembling If request Screen Printing PIN Set/ Heat seal or Ne w C h a l l e n g e N e w C h a l l e n g e N e w T a r g e t N e w T a r g e t 6 4. 1 LCD Classification- TN HTN (LCD Type) (Description) (Twist