改善热压超声球焊点强度的新工艺初探PreliminaryStudyofaNew.PDFVIP

改善热压超声球焊点强度的新工艺初探 改善热压超声球焊点强度的新工艺初探 Preliminary Study of a New Process to Improve the Strength of Thermo-sonic Ball Solder Joint 余斋　王肇　程俊　田怀文 摘 要  由于焊接强度不够而导致金球与焊盘的脱离是目前热压超声球引线键合的主要失效模式。本文通过大 型有限元分析软件ANSYS对超声焊接过程中的金球进行了弹性与弹塑性准静态力学分析，研究了金球在弹性和 弹塑性条件下的受力分布和接触面的滑移情况。根据分析结果并结合微滑移理论，提出了一种新的键合控制方 法来增强球焊点的键合强度。 关键词  球焊点键合；微滑移；工艺 ABSTRACT The separation of golden ball and die pad due to the poor bonding strength of 1st ball solder point is the main failure mode in thermo-sonic ball wire bonding. In this paper, nonlinear elastic and elasto-plastic quasi-static analysis of FAB (free air ball) in ultrasonic vibration process is carried out by finite element method with ANSYS. We study the evolution way of compressive stress distributions of FAB and sliding area in the contact interface under elastic and elasto-plastic deformation. According to the results of the analysis and the mechanism of micro-slip based on elastic theoretical assumption, we propose a new bonding process control that can improve the bonding strength of 1st ball solder point effectively. KEYWORDS Ball bonding;Micro-slip;process 1 Introduction hermo-sonic ball wire bonding has a large market to pay more time to optimize the process in order to Tshare at the current chip-pins package because of its find the best parameter arrangement because there is flexibility and cost effectiveness. The bonding strength still lack of a quantitative understanding of the bonding of solder joints at both ends of wire is the important mechanisms. The reason for this lies in difficulty in indicator to protect the connection of chip and external interpreting the ‘donut’ phenomenon. electronic device. As far as the state of the craft, the real Bonds m