IPC技术标准目录之电子组装（Assembly）.docVIP

　　IPC技术标准目录之电子组装（Assembly）|第1 IPC技术标准目录之 电 子 组 装（Assembly）IPC-T-50FTerms and Definition for Interconnecting and Packaging Electronic Circuits 电子电路互连与封装的定义和术语 IPC-S-100Standards and Specifications Manual 标准和详细说明汇编手册IPC-E-500IPC Electronic Document Collection 已出版的IPC标准电子文档资料合订本IPC-TM-650Test Methods Manual 试验方法手册IPC-ESD-20-20Association Standard for the Development of an ESD Control Program 静电释放控制过程(由静电释放协会制定) IPC/EIA J-STD-001CRequirements for Soldered Electrical Electronic Assemblies 电气与电子组装件锡焊要求IPC-HDBK-001Handbook and Guide to Supplement J-STD-001—Includes Amendment 1 J-STD-001辅助手册及指南及修改说明1 IPC-A-610CAcceptability of Electronic Assemblies 印制板组装件验收条件 IPC-HDBK-610Handbook and Guide to IPC-A-610 (Includes IPC-A-610B to C parison IPC-610手册和指南(包括IPC-A-610B和C的对比) IPC-EA-100-KElectronic Assembly Reference Set 电子组装成套手册，包括：IPC/EIA J-STD-001C，IPC-HDBK-001，IPC-A-610C。IPC/A-A-620Requirements and Acceptance for Cable and -784Guidelines for Chip-on-Board Technology Implementation 芯片直装技术实施导则 IPC/EIA J-STD-026Semiconductor Design Standard for Flip Chip Applications 倒装芯片用半导体设计标准 J-STD-027Mechanical Outline Standard for Flip Chip and Chip Size Configurations FC（倒装片）和CSP(芯片级封装)的外形轮廓标准 IPC/EIA J-STD-028Performance Standard for Construction of Flip Chip and Chip Scale Bumps 倒装芯片及芯片级凸块结构的性能标准SMC-ounting Technology 芯片贴装技术J-STD-013Implementation of Ball Grid Array and Other High Density Technology 球栅阵列 (BGA)及其它高密度封装技术的应用 IPC-7095Design and Assembly Process Implementation for BGAs 球栅阵列的设计与组装过程的实施 IPC/EIA J-STD-032Performance Standard for Ball Grid Array Balls BGA球形凸点的标准规范 IT-98000JPL Chip Scale Packaging Guidelines JPL 发布的CSP导则注：IT (The California Institute of Technology) JPL (The Jet Propulsion Laboratory) IT-98080JPL Ball Grid Array Packaging Guidelines JPL 发布的BGA封装导则 IT-98093ITRI Chip Carrier, Phase 1 Report ITRI 关于芯片载体的报告 ITRI (The Interconnect Technology Research Institute) IPC-MC-790Guidelines for Multichip Module Technology Utilization 多芯片组件技术应用导则 IPC-M-108Cleaning Guides and Hand