干膜法在选择性树脂塞孔工艺中的应用研究 research on the application of dry iflm in the process of selective resin plugging.pdfVIP

印制电路信息 2014 No.4 图形形成与蚀刻 Pattern Formation and Etching 干膜法在选择性树脂塞孔工艺中的应用研究 Paper Code: S-053 叶非华 杨烈文 刘 攀 （广州兴森快捷电路科技有限公司，广东 广州 510663） 摘 要 树脂塞孔工艺中，经常遇到由于板面凹凸不平导致树脂固化后难以打磨的情形。为去 除板面凹处树脂，反复多次磨板极易导致板面露基材；手动打磨，费时费力并且效率 低。为此，本文采用在板面贴干膜的方法进行选择性树脂塞孔。研究了高温烘烤对干 膜物理和褪膜性能的影响，探讨了树脂与干膜表面的作用机理，明确了磨板过程对后 续褪膜的影响。实验结果表明：通过贴干膜可以有效保护板面粘上多余的树脂，高温 烘烤对干膜本身褪膜性能没有明显影响，高温固化时干膜与树脂的接触面发生了一定 程度的共混和化学反应，磨板时必须将干膜表面的残留树脂层以及干膜与树脂接触面 的共混层都去除干净，才能保证后续褪膜的顺利进行。 关键词 选择性树脂塞孔；干膜；磨板；褪膜 中图分类号：TN41 文献标识码：A 文章编号：1009-0096（2014）04-0015-05 Research on the application of dry film in the process of selective resin plugging YE Fei-hua YANG Lie-wen LIU Pan Abstract It was often encountered situation which the board was difficult to be scrubbed cleanly after the resin curing , as the board surface was not flat. To remove recess resin, it easily led to board exposuring substrate if grinded repeatedly; and it was even time-consuming and inefficient if taken manual grinding. To this end, this paper studied that through posting dry film on the board to protected the copper surface which didn’t need to resin plugging, researched the effects of high temperature baking to the physical and stripping properties of dry film, discussed the mechanism of resin and dry film, found the influence of grinding on the subsequent stripping. The results showed that: the board could be effectively protected by dry film to glue excess resin, there was no significant effect on the stripping properties of dry film through the hi