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pcb 的保存(PCB save)
pcb 的保存(PCB save)
There is a specification on the PCB storage period
The storage period for PCB is determined by different surface treatments, as follows:
1, HAL temperature below 35 degrees, humidity is less than 75%RH, time 1 years
2, no-pb-hal temperature below 35 degrees, humidity is less than 75%RH, time 1 years
3, OSP
The temperature is below 35 degrees, the humidity is less than 75%RH, the time is 0.3 years
4, NI-AU:
The temperature is below 35 degrees, the humidity is less than 755RH, the time is 1 years
5, Shen sn/ag
The temperature is less than 35 degrees, and the humidity is less than 75%RH. The time is 6 and 9 months respectively
Above for reference
A PCB unpacking and storage
(1) PCB storage condition 30 C/70% RH.
(2) PCB plate sealed unopened, manufacturing date within 3 months can be directly used on-line.
(4) PCB must be within 5 days on the line after use after unpacking.
(4) for medium and large PCB, the vacuum pack should be re used in 5 days.
Two PCB baking
(1) PCB in the manufacture date within 3 months of sealing opened more than 5 days, before the line to 120 - 5 DEG C baking for 1 hours.
(2) PCB should bake for 1 hours at 120 + 5 for more than 3 months before the date of manufacture.
(3) PCB, for 3 to 6 months before the manufacture date, bake for 2 hours at 120 + 5 degrees before the line.
(4) PCB over 6 months to 1 years prior to the date of manufacture, and bake for 4 hours at 120 + 5 degrees prior to on-line.
(5) the baking PCB should be finished within 5 days, and the oven should be baked for 1 hours before use.
(6) if PCB exceeds 1 years of manufacture date, bake for 4 hours at 120 + 5 degrees before on-line, and re confirm solderability before on-line
Use。
Three PCB baking method
(1) large PCB is placed in a horizontal position, with a stack of up to 10
Slice, bake for 10 minutes, turn on the oven, remove the PCB flat, let it cool naturally, and pay attention to the baking process to prevent the board from bending.
(2) medium and smal
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