毕业论文（设计）LTCC组件热特性仿真分析.docxVIP

摘 要 低温共烧陶瓷（Low-Temperature Co-fired Ceramic, LTCC）技术是多芯片组件中的一种高集成度多层布线封装技术，其三维立体结构是系统小型化的有效途径。如今快速发展的电子技术，LTCC组件的小型化、高性能化、多功能化已成为必然趋势，电子产品的温度每急剧上升10 ℃，可靠度就会降低到原来的一半。为了确保芯片组件高可靠性、性能稳定、寿命长，有必要对其热场分布及散热情况进行分析研究。本文采用有限元软件ANSYS 建立了一种适用于特定需求的LTCC基板上放置芯片的三维LTCC组件的热模型，对三维模型进行了温度分布情况的模拟分析。得到了LTCC组件整体温度分布云图、LTCC基板温度分布云图、五个芯片温度云图、对流分布云图、速度矢量图热流密度云图等，并通过改变芯片的布局及添加散热器的方式进行了散热优化分析分析。文中通过对该大型工具软件ANSYS的学习了解及掌握，不仅探索出了ANSYS软件的运用方法及应用特点，而且通过具体应用为特定电子组件的热分析提供了重要参考，也为以后更好的运用计算机辅助设计奠定了基础。关键词：LTCC组件； 温度场； 热分析； ANSYSSimulation Analysis of Thermal Characteristics of LTCC ModuleStudent：LUO En-lai Teacher: DAI Xuan-junAbstract：Low-Temperature Co-fired Ceramic(LTCC)technique is a high integration density of multilayer wiring packaging technology of multiple chip components, and it’s three-dimensionalstructure is an effective way of system miniaturization. Nowadays, the rapid development of electronic technology, the maniaturization of LTCC components, high-performance and multifunction have become an inevitable trend. The electronic products’ temperature rise 10 ℃ sharply, while the reliability will be redduced to half of their original. In order to ensure the high reliability, stable performance and long service life of the chip components, it is necessary to carry out a research and analysis on it’s thermal field distributionand heat dissipation.The finite element software ANSYS is adopted to establish the thermal model of three-dimensional LTCC components, which is suitabla for palcing the chip in the LTCC substrate with specific requirements. Give a simulation analysis of the temperature distribution on three-dimensional model under the main consideration of conduction and heat lossing through convection, then get and analyze the overall temperature distribuction map of the LTCC component, the five chips and the section, the velocity vector diagram, and thermal flux nephogram, etc.. and through change the chip layout and add radiator for cooling optimization analysis. This paper th