教学课件SSW-7.ppt

Solid State WeldingClass 7 Instructor: LI Wen-Ya (Ph. D, Asso. Prof.) Shaanxi Key Laboratory of Friction Welding Technologies, School of Materials Science Engineering, Northwestern Polytechnical University Email: liwy@nwpu.edu.cn Tel.:QQReview Describe the process of FSW? Review List the processing parameters of FSW? Tool design (geometry) Tool rotational speed traverse speed Which types of materials can be welded by FSW? Al alloys, especially 2xxx and 7xxx Other materials: Mg alloy, Cu alloy, Ti alloy, steel, superalloy, MMCs, etc. Supplement FSW joint type Lecture 7: Fundamentals of Diffusion Bonding --Soldering and Brazing Nomenclature Diffusion Bonding (DB) Welding, Joining Hot-pressing (hyphen) Vacuum diffusion bonding (VDB) Transient Liquid Phase Diffusion Bonding (TLP welding) Soldering Low melting point, such as Sn and Pb alloys Brazing High melting point, such as Cu alloy Introduction In its most narrow definition, which is used to differentiate it from other joining processes such as deformation bonding or transient liquid phase joining, diffusion bonding (DB) is a process that produces solid-state coalescence between two materials under the following conditions: Joining occurs at a temperature below the melting point, Tm, of the materials to be joined (usually 1/2Tm). Introduction Coalescence of contacting surfaces is produced with loads below those that would cause macroscopic deformation to the part. A bonding aid can be used, such as an interface foil or coating, to either facilitate bonding or prevent the creation of brittle phases between dissimilar materials, but the material should not produce a low-temperature liquid eutectic upon reaction with the materials to be joined. Introduction Thus, diffusion bonding facilitates the joining of materials to produce components with no abrupt discontinuity in the microstructure and with a minimum of deformation. Mechanism of Diffusion Bonding Each stage is associ