石墨纳米片对铜电子浆料导电性的影响.docVIP

石墨纳米片对铜电子浆料导电性的影响 时晶晶屈银虎成小乐周宗团符寒光祁志旭 安工程大学机电工程学院 为改善铜浆导电性，以表面改性的贱金属铜粉为主要导电相，通过添加少量导 电性优异的石墨纳米片作为导电增强相制备复合电子浆料，并采用四探针测试 仪、扫描电子显微镜（SEM）等分析测试方法研究丫石墨纳米片的参数、添加量 对铜电子浆料导电性能的影响.结果表明:选用厚度为35 ?，片径为5 u m的石墨 纳米片作为导电增强相，制得石墨纳米片一铜电子浆料，在460°C烧结后导电 膜层的电阻率较小;石墨纳米片与铜粉质量比为2 : 98时，测得浆料电阻率为 17. 14 mQ ? cm,相比纯铜浆料电阻率34. 43 mQ ? cm降低了 50. 22%.分析电子 浆料导电机理并建立导电相连接几何模型，在导电膜层屮，部分折断的石墨纳 米片会填充到铜颗粒之间的空隙中，较长石墨纳米片则会形成“搭桥”现象， 增加导电相之间的连接，形成较紧密的微观组织和良好的导电网络，从而改善 复合浆料的导电性. 关键词： 石墨纳米片;电子浆料;铜粉;电阻率;导电机理; 时晶晶（1992—），女，研宄生. 屈银虎，E-mail :quyinhu@xpu. edu.cn. 2017-04-27 基金：陝西省科学技术研究发展计划-工业攻关攻关项0 （2013K09-33） Influences of graphene flake on conductivity of copper electronic pastes SHI Jingjing QU Yinhu CHENG Xiaole ZHOU Zongtuan FU Hanguang QI Zhixu School of Mechanical and El e ctr onicEng i ne ering, Xiz an Polytechnic University; Abstract： To improve the conductivity of the copper paste, the surface-treated copper powders were used asthe main conductive phase and a small amount of graphene flake was as the conductive reinforced phase toprepare the composite electronic paste. Influences of the specifications and additions of graphene flake wcrccharactorized by Four-Point probe, scanning electron microscopy (SEM) and other testing methods. The resultsshow the paste with the graphene flake with thickness of 3 ~ 5 nm and flake size of 5 u m has a smallerresistivity. The better mass proportion of 2 : 98 between graphene flake and copper powders is concluded. Theresistivity of the paste is 17. 14 mQ ? cm, which is decreased by 50. 22% compared to that of the copper paste. The conductive mechanism of the electronic paste is analyzed and geometric model of connection of theconductive phase is built. In the conductive film, the gaps between copper powders are filled by the brokengraphene flake and bridges are jointed between copper powders by longer graphcnchc flake. It has a compactmicrostructure and good conductive network. This increases the conductivity of the paste. Keyword： graphene flake; copper powders; elec