ANSYS在半导体封装行业中的应用.pptVIP

* Delamination due to moisture C-SAM images of delamination at the chip/underfill interface of flip chip at 85oC/85%RH Moisture Analysis * Popcorn due to moisture Mechanism of package cracking Moisture Analysis * Adhesive strength decreased due to moisture Comparison of adhesive strength at MC/Cu interface between dry sample and wet sample Moisture Analysis * Adhesive strength simulation at interface during reflow Typical temperature curve for eutectic SnPb solder during reflow process Thermal stress simulation at 200oC Moisture Analysis * JEDEC standards for moisture testing Moisture Analysis Moisture Sensitivity Levels Loading conditions as JEDEC standards in ANSYS * Popcorn prediction with moisture concentration at interface Moisture Analysis Moisture concentration of the node at the chip/underfill interface of flip chip * Applications in IC Packaging with ANSYS Mechanical and Thermal analysis with Full ANSYS capabilities. User-customized Graphics User Interface Parametric geometry creation Include all simulation in IC packaging,such as, Thermal Resistance Moisture Popcorn Die Crack Warpage Solderjoint fatigue life Web-based analysis report generating * Step 1: Select a package mode * Step 2: Basic setup * Step 3:Modeling Die Die attach * Step 4 : Modeling Molding * Step 5 : Modeling Die Pad * Step 6 : Modeling Power Rings * Step 7 : Modeling Substrate * Step 8 : Modeling Thermal VIA * Step 9 : Modeling Ground Pad * Step 10 : Modeling Pad * Step 11 : Modeling Solder Mask * Step 12 : Modeling Solder Balls * Step 13 : Modeling Lead Traces * Step 14 : Modeling PCB * Step 15: Creating the whole model * Step 16: Analysis setup * Step 17: View results Generate Report * Summary Simulation is very important step with ANSYS in IC packaging design. Reasonable material model can be built by corresponding element types in ANSYS, including elastic material, viscoelastic material, viscoplastic material and other nonlinear material models Stress/Strain analysis