Reverse Engineering amp; Emulation Process逆向工程和仿真的过程；.pptVIP

COMPANY PRIVATE * TLSI’s Integrated Circuit Replacement Program COMPANY PRIVATE * TLSI Reverse Engineering Emulation (TREE) Process TLSI’s Answer to IC and ASIC Obsolescence in Military Aerospace Systems COMPANY PRIVATE * TREE offers… The End of Obsolescence as we know it. COMPANY PRIVATE * Good Candidates for TREE Analog IC’s and Custom Analog ASICs Digital IC’s and Custom Digital ASICs (350K gates) Mixed-Signal IC’s and Custom Mixed-Signal ASICs FPGAs PLDs Processes: CMOS, BiCMOS, BiPolar, DMOS, SiGe Feature Sizes: 0.25μ to 5.0μ COMPANY PRIVATE * Poor Candidates for TREE Digital IC’s and Custom Digital ASICs (350K gates) Rad Hard IC’s and Custom Rad Hard ASICs Large Memory IC’s MMIC’s, Microwave Processes: GaAs, MESFET, PHEMT, GaInP HBT COMPANY PRIVATE * The TLSI Advantage Never experience obsolescence for ANY device supplied by TLSI Low up-front engineering fees (NRE’s) Low overall cost compared to other solutions Aggressive lead-times Small minimum order quantities Minimum 20 year guaranteed source of supply Dedicated to supporting Military/Aerospace market Plastic or ceramic (hermetic) packaging options Dual Source – true second source capability Over 25 years in business System level design expertise COMPANY PRIVATE * Advantages of TREE Process “Form/Fit/Function” replacements for obsolete devices Integration of additional features for value engineering initiatives Minimum 20 year guaranteed source of supply Low risk approach Not limited to one process technology Domestic foundries packaging houses meet CONUS Access to “Sunset Technology” processes (~2.0μ+) Flip-chip or solder-bumped die ISO 9001, BAEB, MIL-M-38510, etc. COMPANY PRIVATE * TREE Process Candidates “FPGA to ASIC” conversions “ASIC to ASIC” conversions “Obsolete IC to ASIC” conversions COMPANY PRIVATE * Basic Steps of TREE Process Obtain IC samples, schematics other documentation (if available) Decapsulate and selectively etch to the desired metal and