基于边缘电场传感器的介电测量方法和系统分析-dielectric measurement method and system analysis based on fringe electric field sensor.docxVIP

Study on Dielectric Measurement Method and System Based on Fringing Electric Field SensorsABSTRACTFringing electric field (FEF) sensors have different characteristics from the traditional capacitive sensor, which the electrodes are in the same plane or curved surface. FEF sensors are widely used in non-destructive measurement of product characteristics in industrial process control, including porosity, moisture, density, and viscosity, with the advantages of single-side access, adjustable signal strength and tomography capability. Dielectric constant is acquired by the capacitance and resistance between the electrodes of FEF sensors.The thesis focus on three-wavelength FEF sensor, a measurement system based on digital signal processor (DSP) is proposed. The system included DSP, driving circuit, conditioning circuit, the simultaneous sampling circuit, man -machine interface circuit. The driving circuit generate sinusoidal drive signal with different frequency .The conditioning circuit amplify and filtering the output signals from the different channels. The sampling circuit acquire the output signals and deliver the data to DSP.According to the short circuit current measurement mode, the formula of the FEF sensors’ capacitance and resistance are deduced. The frequency, amplitude and phase of the signals are calculated by using spectrum analysis. In order to guarantee the measurement accuracy, the sampling frequency is selected in the different signal division and the spectrum correction is used . The permittivity is calculated by the multivariate nonlinear regression method.The system software is designed, including the main monitor program, the initialization module, the driving control module, the sample module, the calculate module and the man-machine interface module. It achieved providin g driving signal, measurement multi-frequency signals, processing data, display and setting the parameters.The experiments for thickness measurement, PCB plate flaw and power c