flotherm芯片封装培训教材上.ppt

Agenda The What’s and Why’s of this course Basic Packaging Concepts Packaging Materials Introduction to FLOPACK The what’s and why’s of this course Why is package level modeling necessary ? The only reliable way to obtain accurate case temperature The only reliable way of obtaining accurate junction temperature Junction temperature drives reliability; Case temperature provided to end-user So what’s the bottleneck? It is difficult to keep up with the rapidly changing field of IC packaging, especially for system designers (end-users) Some modeling assumptions are not obvious Do I model my tr