第02讲——测试过程和设备 超大规模集成电路测试技术 知识课件.pptVIP

VLSI Test: lpx/Lecture 2 6.2 LTX FUSION HF ATE 6.2.1 Specifications规范 Intended for SOC test – digital, analog, and memory test – supports scan-based test Modular – can be upgraded with additional instruments as test requirements change enVision Operating System（一种可视化软件） 1 or 2 test heads per tester, maximum of 1024 digital pins, 1 GHz maximum test rate Maximum 64M vectors memory storage Analog instruments: DSP-based synthesizers, digitizers, time measurement, power test, Radio Frequency (RF) source and measurement capability (4.3 GHz) 6.2.2 Multi-site Testing多现场测试 定义：One ATE tests several devices at the same time 目的：Major Cost Reduction 范围：For both probe and package test 方法： DUT interface board has 1 sockets Add more instruments to ATE to handle multiple devices simultaneously 能力： Usually test 2 or 4 DUTS at a time, usually test 32 or 64 memory chips at a time 限制： # instruments available in ATE, type of handling equipment available for package 7. Electrical Parametric Testing 电子参数测试 Probe test wafer sort, catches gross defects Contact electrical test Functional layout-related test DC parametric test AC parametric test Electrical faults Unacceptable voltage/current/delay at pin Unacceptable device operation limits 7.1 DC Parametric Tests直流参数测试 用欧姆定律测试器件的稳态电气特性 方法是给电压测电流，或倒过来 ATE中的参数测量单元PMU用于DC参数测试 7.1.1 Contact Test接触测试 目的：验证芯片引脚没有开路或短路 方法： Set all inputs to 0 V Force current Ifb out of pin (expect Ifb to be 100 to 250 mA) Measure pin voltage Vpin. Calculate pin resistance R 结果： Contact short (R = 0 W) No problem Pin open circuited (R huge), Ifb and Vpin large 7.1.2 Power Consumption Test功耗测试 目的：找出输入静态、动态条件下最坏的功耗情况 方法： Set temperature to worst case, open circuit DUT outputs Measure maximum device current drawn from supply ICC at specified voltage 结果： ICC 70 mA (fails) 40 mA ICC 70 mA (ok) 7.1.3 Output Short Current Test输出短路电流测试 目的：验证在高、低输出电压下提供的输出电流驱动能力 方法： Make chip output a logic 1 Short output pin to 0 V in PMU Measure short current (but not for