h审审bnsi3n4多孔复合陶瓷的微观组织结构与性能研究-h examination of microstructure and properties of bnsi 3n4 porous composite ceramics.docx

哈尔滨工业大学工学硕士学位论文 哈尔滨工业大学工学硕士学位论文 Abstract Using activated carbon as a pore-forming agent, we have fabricated porous h- BN/Si3N4 composite ceramics by cold isostatic process (CIP) followed pressureless sintering. The effects of h-BN content, porosity and sintering aids on the microstructure, mechanical properties, thermal properties and dielectric properties of h-BN/Si3N4 ceramic were investigated by XRD, SEM techniques and three points bending tests. By systematic research on CIP, we got the optimal green compact forming conditions including the binder content, grain composition, molding pressure and pressure-holding time etc. By investigating pore-forming removal in muffle furnace, we obtained the optimal conditions for pore-forming agent removal processing such as the heating rate, calcine temperature and holding time, and porous h-BN/Si3N4 composite ceramics were prepared. The effects of h-BN content, porosity, sintering aids on the microstructure and properties were investigated. It was found that the mechanical properties, thermal properties, dielectric properties and machinability of Si3N4 ceramics could be highly improved with the introduction of h-BN. The porosity was controlled by pore-forming agent content, and the pore shape was determined by the pore- forming agent shape, the thermal properties and dielectric properties were correlated with the porosity. When Al2O3+Y2O3 was used as sintering aids, the composite porous ceramic have a better sintering ability, more excellent bending fracture strength and thermal properties were achieved, but the dielectric properties was slightly aggravated compared with that when La2O3+Y2O3 was used as sintering aids. The investigating results in this paper will be good for the development of the relevant porous composite ceramics with excellent mechanical properties, thermal properties and dielectric properties. Keywords: porous ceramic, h-BN/Si3N4 composites, CIP, pressureless sintering, thermal properties, dielectric p