印制电路板电镀填孔添加剂应用工艺分析-analysis on application process of hole filling additive in pcb electroplating.docxVIP

目录第一章文献综述............................................................................................................................11.1印制电路板综述...........................................................................................................................11.1.1印制电路板基本概念..............................................................................................11.1.2印制电路板的功能..................................................................................................11.1.3印制电路板的分类..................................................................................................21.1.4印制电路板的制造方法..........................................................................................21.1.5HDI（高密度互联）多层印制电路板的制作流程21.2影响电镀填孔的影响因素.........................................................................................................41.2.1化学影响因素..........................................................................................................41.2.2物理影响因素..........................................................................................................61.3填孔添加剂的研究进展.............................................................................................................61.4本课题研究目的、意义、内容及研究创新点........................................................................91.4.1研究目的、意义和内容..........................................................................................91.4.2创新点....................................................................................................................10第二章实验..................................................................................................................................112.1实验试剂、仪器及材料............................................................................................................112.1.1实验试剂................................................................................................................112.1.2实验仪器...................................................................