三维网络结构3d-sial复合材料微观组织设计及性能研究-study on microstructure design and properties of 3d - sial composite with three-dimensional network structure.docx

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2018-07-29 发布于上海
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三维网络结构3d-sial复合材料微观组织设计及性能研究-study on microstructure design and properties of 3d - sial composite with three-dimensional network structure.docx

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三维网络结构3d-sial复合材料微观组织设计及性能研究-study on microstructure design and properties of 3d - sial composite with three-dimensional network structure

料的弹性模量随着增强体体积份数的增加而增加，并且大致呈线性增加；三维网络化结构对弹性模量的贡献很小；可用H-S模型下限值预测复合材料的弹性模量。关键词Si/Al复合材料；三维网络结构；微观组织；物理性能；力学性能AbstractSireinforcesAlmatrix(Si/Al)compositesaredesignedandfabricatedinthispaper.Microstructuresandformationmechanismsareinvestigatedbyopticalmicroscope,scanningelectronmicroscope(SEM),transmissionelectronmicroscope(TEM).Physicalandmechanicalpropertiesaremeasuredbydilatometer,thermalconductivityandelectricalconductivitytester,brinellhardnessandthree-pointbendingtestsandtheirinfluencingfactorsareanalysis.Thenewmethodofthermaldiffusionandcoalescenceisintroducedfromtheviewofmicrostructuredesign.Special3-DstructureisobtainedfortheSireinforcementinSip/Alcomposites,whichoptimumSi-Alinterfaces,precipitatingSiphasesinthematrix,decreasingcoefficientsofthermalexpansionandimprovingthemechanicalproperties.Theconditionofachieving3-Dstructureisproposedafterananalysisonthermaldiffusionandcoalescence.Itisindicatedthat3-DnetworkthermaldiffusionandcoalescenceisaprocessofatomicdiffusionfromSip/Alcomposites.Itisdividedintothreestages,whichincludemelting,dissolutionprecipitationbydiffusionandsolidification;thestageisinterpretedusingGibbs-Thomas’seffectofSi-Alsystem.BasedonGibbs-Thomas’slaw,theprecipitationmodelcontrolledbydiffusionandcoalescenceisestablishedforthe3D-Si/Alcomposites.ThereisalotofdislocationinAlmatrixforpreparativecomposite,smoothandcleaninterfaceofSi-Alandnoreactivematerialsonthisinterface.Thecharacterizationof3-Dnetwork3D-Si/AlcompositesaresmoothcurvesandsomedispersedfineparticlesofSi.Averagecoefficientsoflinearexpansion(20~100℃)forSi/Alcompositesarebetween7.4~10.1×10-6/℃,andthethermalconductivityvariesfrom112to168W/(m·℃),andconductivityare6.5~8%IACS.CoefficientsofthermalexpansionofSip/Alcompositesincreaseduringtemperaturerising,whereasthethermalconductivitydecreases;coefficientsofthermalexpansion,thermalconductivityandelectricalconductivitygenerallydecreasewiththeincreasingofSielementcontent.CoefficientsofthermalexpansionofSi/Alcompositesdecreaseasaresultofdecreasi