(SiCP+Cu)Al电子封装材料制备及组织性能研究材料工程专业论文.docxVIP

哈尔滨工业大学工程硕士学位论文 哈尔滨工业大学工程硕士学位论文 - - II - Abstract In this paper, (SiCP+Cu)/Al electronic packaging composites were acquired by cold isostatic pressing (CIP)+ pre-pressing+hot extrusion . The weight percent of SiCP were fixed at 30%, then vary the weight percent of Cu 5%, 8%, 10%。Using TEM, SEM, dilatometer，thermal conductivity testing，we get the thermo-physical and mechanical properties and the microstructure of (SiCP+Cu)/Al electronic packaging composites. Composites by CIP were pre-pressed at 300℃ in order to increase the density. The ultimate composites were fabricated by hot extrusion at two different temperature(400℃，450℃). The rusult shows that the microstructure of composites seems to be much dense and homogeneous, and there are no obvious holes and inhomogeneity. When hot extrusion at 450℃, CuAl2 was synthesized by Al and Cu and there is no Cu remaining. However, there is some Cu in the composites when hot extrusion at 400℃. As a result, the temperature of hot extrusion influence the reaction of Al and Cu. The mechanical properties of composites were meaured and analysed in this experiment. The result shows that the UTS and Modulus of elasticity both grow with the increasing of Cu at both hot extrusion of temperature of 400℃ and 450℃. The UTS of composites hot extrusion at 400℃ is bigger than that of 450℃， however，the Modulus of elasticity of composites at 400℃ is smaller than that of 450℃. This conclusion is related to the appearance of CuAl2. Finally we obtain the electronic packaging composites with appropriate mechanical properties. Most importantly, thermo-physical properties of the composites were measrued and analysed in the progress of experiment. The result shows the thermal conductivity of composite at both two hot extrusion(450℃ and 400℃) temperature show a increase trend with the increasing of Cu. And the Thermal conductivity of 400℃ are better than that of 450℃. Also we use Hasselman model to compare with the experimental data and th