苯并噁嗪改性环氧树脂的制备及性能研究-材料工程专业论文.docxVIP

万方数据 混体系中，当 BOZ 与 EP 的质量比为 4:6 时，共混体系固化物的综合 性能最好。 以 BOZ:EP =4:6 的 BOZ/EP/MeTHPA 共混体系为例，研究了酸酐 含量对共混体系性能的影响。研究结果表明：酸酐含量为环氧树脂质 量的 40%时达到最大，在所研究的共混体系中综合性能最优。 关键词：苯并噁嗪，环氧树脂，耐热性能，电气绝缘性能 II  ABSTRACT Epoxy Resin has excellent corrosion resistance,chemical stability, adhesive property, ease of processing performance and low cost.Hence, Epoxy Resin is widely used in electrical and electronic fields.However,the cured resin which is obtained from the curing reaction of general epoxy resin and curing agent exhibits poor perfomance in heat resistance and high temperature dielectric property ,that is difficult to meet the higher performance which is required in electronic and electrical fields. Hence, to improve the heat resistance and electrical insulation is imperative.In this paper, epoxy/anhydride(MeTHPA)/imidazole(2E4MZ) system and epoxy/anhydride system were modified by 3,3-Phenylmethane bis(3,4-dihydro-2 H-1,3-benzoxazine)(BOZ), in order to improve the heat resistance and electrical insulation the heat resistance and electrical insulation of epoxy system. The curing process of BOZ/EP/MeTHPA/2E4MZ was analyzed by Fourier transform infrared spectroscopy(FTIR).The result showed that epoxy resin first cured with anhydride catalyzed by imidazole at 100℃, and cured completely at 150℃, then benzoxazine had ring-opening polymerization at 180℃; The cured kinetic of the blending system was analyzed by non-isothermal DSC. The kinetic parameters and mathematical model were obtained by Flynn-Wall-Ozawa and Friedman method. And the research showed that kinetic mathematical model has excellent accuracy. The properties of BOZ/EP/MeTHPA/2E4MZ blending systems were analyzed. The result showed that blends exhibited good compatibility and had only one glass transition temperature(Tg).The glassy storage modulus of the cured blends was improved with increasing content of BOZ, while the glass transition temperature(Tg) was increased slightly and the thermal resistance temperature was dec