超声波特性参数对Wafer清洗效果的影响机理及实验分析-光学工程专业论文.docxVIP

ABSTRACT Ultrasonic cleaning is better than regular cleaning, especially for mechanical components with complicated surface pattern, such as pitted surface or with blind holes, or smaller products with critical demand in cleanliness, such as semi-conductor products, wafers, watches, precision parts, electron components and circuit boards. Ultrasonic cleaning has very ideal cleaning result for these parts. This article introduces influence mechanism of different parameter setting of ultrasonic wave on wafer cleaning, discuss factors, including theory of ultrasonic facilities, ultrasonic frequency, influencing factors on ultrasonic cleaning, through experiments to find the suitable cleaning technology parameters. So as to solve cleaning issues and meet customer’s demand on cleanliness, which helps to achieve mass production of wafers. In our production, cleaning defects such as white cloud、particle haze、cleaning haze、scratch、photo-resist residue have great impact on quality, even cause loss of whole lot of products. In this article is to elaborate ultrasonic optimum parameters selection through the below three aspects. Systematically introduce the composition and theory of ultrasonic equipment Selection of ultrasonic frequency. Elaborate how ultrasonic wave and Megacoustic wave work. Summarize factors that affect ultrasonic wafer cleaning and noninvasive ultrasonic cleaning method. Key words: Ultrasonic cleaning、wafer、 DLP 目录 HYPERLINK \l _bookmark0 目录4 HYPERLINK \l _bookmark1 第一章 绪论1 HYPERLINK \l _bookmark2 1.1 Wafer清洗线简介 1 HYPERLINK \l _bookmark3 1.1.1 Wafer清洗线的技术性能参数 1 HYPERLINK \l _bookmark4 1.1.2 工艺流程1 HYPERLINK \l _bookmark5 1.1.3 设备功能说明 2 HYPERLINK \l _bookmark6 1.1.4 超声波清洗线原理 2 HYPERLINK \l _bookmark7 1.1.5 超声波清洗线的技术特点 4 HYPERLINK \l _bookmark8 1.2 wafer产品的应用及市场 5 HYPERLINK \l _bookmark9 1.2.1 DLP成像器件原理 8 HYPERLINK \l _bookmark10 1.2.2 我们的产品数码窗口片 9 HYPERLINK \l _bookmark11 1.3 研究思路与工作安排 9 HYPERLINK \l _bookmark12 1.4 本章小结： 10 HYPERLINK