多场作用下晶内微裂纹的演化-工程力学专业论文.docxVIP

南京航空航天大学硕士学位论文 南京航空航天大学硕士学位论文 多场作用下晶内微裂纹的演化 多场作用下晶内微裂纹的演化 i i ii ii 摘 要 随着集成电路的日益微型化，金属薄膜内连导线在多场耦合环境下的可靠性成为越来越重 要的科学问题。力、电共同作用下材料内部微裂纹的演化是导致集成电路内连导线失效的主要 原因。本文主要研究了曲率、应力场、电场共同作用下表面扩散主导的金属材料内部晶内微裂 纹的演化规律。 首先，建立了曲率、电场、应力场共同作用下晶内微裂纹的演化模型。在表面扩散的经典 理论及其弱解描述的基础上，得到了多场作用下微裂纹演化的有限元控制方程，编制了可模拟 曲率、电场、应力场共同作用下表面扩散主导的二维晶内微裂纹演化的有限元程序，并验证了 该程序的可靠性和准确性。 然后，对应力场、电场和表面曲率共同作用下细长金属导线中晶内微裂纹的演化进行了数 值模拟。详细讨论了微裂纹形态、应力大小和状态、电场大小和导体边界等因素对微裂纹演化 的影响规律。 最后，建立了内压和电场共同作用下晶内微裂纹的演化模型。在可模拟表面扩散控制下表 面能、应变能和电场能诱发微结构演化的程序上，添加了可分析内压对二维晶内裂纹演化影响 的程序模块。较详细地分析了内压对晶内微裂纹在电场下的影响规律。 关键词：微裂纹演化，表面扩散，电场，应力场，内压，有限元 ABSTRACT With the ever-increasing microminiaturization of integrated circuit, metal film interconnect reliability under multi-physical fields has become a more and more important scientific problem. The migration and evolution of microcracks in metal material induced by stress field and electric field is the major failure mode of interconnect. This paper is focused on the evolution of intragranular microcrack in metal material due to strain and electromigration induced surface diffusion. First of all, a simplified evolution model of intragranular microcracks under electric field and stress field is established. Based on the theory of surface diffusion and its weak statement, a finite element scheme is implemented and a program is developed for simulating the evolution of two-dimensional microcracks within grains under stress field and electric field. And the reliability of the program is proved in detail. Then, the evolution of intragranular microcracks induced by the stress field, the electric field and the curvature of surface is simulated, which are in a long thin elastic conductor. The effects of the aspect ratio, the magnitude and the state of the stress, the electric field and the conductor boundary on the evolution are investigated detailedly in the dissertation. Finally, a simplified model of intragranular microcracks with inter pressure under electric field is established and a new module is add