二次配电装置的温度场仿真及优化设计-电气工程专业论文.docxVIP

二次配电装置的温度场仿真及优化设计 摘 要 目前，电子元器件应用于越来越多的领域。随着电子元器件集成化程度的提高和小型 化的发展趋势，可供散热的空间越来越小，导致电子设备的温升越来越高。如果热量不能 够及时地散发出去，就会造成热量的积聚，导致电子设备可靠性降低。尤其在航空、航天 等重要的领域中，对电子设备的热可靠性要求更高。因此，对电子设备散热技术的研究显 得十分重要。 二次配电装置（SPDA）作为先进固态配电系统的关键技术之一，广泛应用于航空、航 天领域。它主要由固态功率器件组成，发热量大，其热设计的好坏直接影响配电系统的可 靠性。因而，电子设备的温度场仿真及热设计对提高器件的可靠性有着重要的意义。 本论文以二次配电装置样机为例，采用基于有限体积法的热分析软件 Icepak 对其进 行三维温度场的仿真和分析；利用 Icepak 的 Zoom-in 功能对机箱内部的 PCB 板和散热铝 基板进行了局部仿真；分析了散热器参数对散热性能的影响；采用 Icepak 软件的优化功 能对散热器参数进行了优化；采用正交统计法对优化结果进行了验证；在肋片式散热器优 化达不到热设计要求的情况下，还采取了其它优化措施；最后对优化后的二次配电装置进 行了系统级、部件级温度场仿真，结果符合二次配电装置的热设计要求。 关键词：二次配电装置，Icepak，温度场仿真，优化设计 i THE TEMPERATURE FIELD SIMULATION AND OPTIMIZATION OF A SECONDARY POWER DISTRIBUTION ASSEMBLY ABSTRACT Presently,the application of the electric equipments becomes more and more wide. Because of density of integration’s enhancement and the development trend of small,the space for heat dissipation is getting smaller and smaller,leading to increasingly high temperature in electronic devices. If the heat is not out of the dissemination timely,it will reduced reliability of electronic equipment. Especially in the important fields,such as aviation and spaceflight,the electric equipments’ reliability is demanded more strictly. In view of the above,it is essential to study the thermal design and analysis techniques of electronic equipments. As the key technique of solid state switching system,the secondary power distribution assembly (SPDA) applies in aviation and spaceflight widely. This secondary power distribution assembly can produce lots of heat,so the thermal design can influence the reliability of switching system directly. Above all,we should attach more attention to thermal design and analysis techniques. It is very important to enhance the thermal reliability of electronic equipments. This article illustrates the 3D temperature simulating and thermal analysis of a secondary power distribution assembly by the analysis software Icepak,and using Icepak the Zoom-in function on the PCB board