高速PCB中通孔的信号完整性分析与建模方法研究-测试计量技术及仪器专业论文.docxVIP

摘要 摘要 Abst Abstract I万方数据 I 万方数据 万方数据 万方数据 摘 要 随着集成电路设计技术的飞速发展，工艺技术的不断提高，高速电路中互连结 构的信号完整性(Signal Integrity, SI)问题日趋严重，尤其是复杂互连结构通孔， 具有不连续性、不均匀性和寄生效应等影响信号传输质量，建模和分析较复杂，且 应用广泛，对其信号完整性分析与建模方法提出了迫切要求。因此，对高速印刷电 路板(Printed Circuit Board, PCB)中通孔结构的信号完整性分析与建模方法的研 究是十分有必要的，将对缩短产品设计时间、提高产品可靠性具有实用的指导意义。 本文针对高速多层 PCB 中的互连结构通孔的信号完整性分析和建模方法，做了如下 工作： 1. 针对过孔的回波损耗和插入损耗，通过建模仿真讨论通孔信号完整性的影响 因素并分析仿真结果。并通过对比说明盲孔、埋孔和反钻孔优越于同等参数条件下 的有短柱通孔的传输性能。 2. 基于二端口网络理论，运用场路结合的分析方法，对单通孔进行等效电路建 模并仿真验证，提取等效电路的模型参数并验证。结果表明，通孔有限元场分析模 型和等效电路模型仿真得到的 S 参数曲线有着很好的相似，证明了文中等效电路模 型的有效性。 3. 针对双通孔结构的远端串扰噪声，通过建模仿真讨论双通孔信号完整性的影 响因素，并对仿真结果进行分析。 4. 针对双通孔的结构参数对传输性能的影响进行正交试验设计，分析试验结果 得出主次影响因素以及显著因素，综合上述试验结果和因素交互作用，基于多元回 归方法对双通孔的传输性能进行结构参数建模并验证。结果表明，本文所建立的参 数模型在试验条件下是有效模型，能够通过给定双通孔结构参数较好的描述双通孔 的传输性能。 关键词：信号完整性，通孔，影响因素，等效电路模型，结构参数模型 Abstract With the rapid development of integrated circuit design and the continuous improvement of technology technique, the Signal Integrity (SI) problem of high speed interconnects has become more and more serious. Especially the complicated interconnects via, which discontinuities, nonuniformities or parasitic effects bring impact on signals transmission quality, is difficult to model and analyze but widely applied, that give urgent request for its signal integrity and the modeling method. Therefore, the research on SI analysis and modeling method of via structure in high speed Printed Circuit Board (PCB) is of great necessity, which can be practical guidance for reducing the design time and improving reliability of the product. This paper completed following work for the SI analysis and modeling method of interconnects via in high speed multilayer PCB. Aiming at the return loss and insertion loss, the effect of parameter factors on the SI of via was discussed by means of modeling and simulation, and then the simulation results were analyzed. By analysis and comparison, it was shown that the transmission performance of blind via, bury via and back-drill via is more superior to via with a stub.