导热硅橡胶的制备与性能研究材料物理与化学专业论文.docxVIP

导热硅橡胶的制备与性能研究材料物理与化学专业论文.docx

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导热硅橡胶的制备与性能研究材料物理与化学专业论文

摘要Abstract 摘要 Abstract With the rapid development of integrated technology and assembly technology in the field of electronic and electrical.The volume of the circuit and electronic components has been shrinking and the thermal conductivity of the interface materials put forward higher requirements.Conventional heat conducting materials are mostly metal materials,but the performance of metal materials in the process of corrosion resistance is poor,and the application in some fields is limited.Polymer materials have excellent performance of corrosion resistance,but due to the polymer materials is a poor conductor of heat,SO single polymer materials is far below the requirements of the use of.Therefore,the preparation of high thermal conductive polymer materials with very high practical value.In many polymer materials,silicone rubber has stable chemical properties,high and low temperature resistance,high pressure resistance, ozone aging resistance, solvent resistance, radiation resistance, weather ability, physiological inert,high permeability and biological compatibility and other excellent properties,application field is more and more widely.Because of the research and manufacture of the thermal conductive silicone rubber v/as prepared with great significance. This paper chooses four different morphologies of high thermal conductive fillers, studv flller morphology and amount of the thermal conductivity of thermal conductive silicone rubber compositef—mechanical properties,thermal stability,crosslinking density;the same packing different particle size and different particle diameter compound on the properties of heat conductive silicone rubber composite influence; comDound fillers with different morphology for the comprehensive performance of heat conductive silicone rubber composite materials.The main research contents and results are as follows: (1)selection of platelet boron nitride and spherical alumina,irregular aluminuIn nitride particle,carbon fiber as filler

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