焊膏可印刷性测试仪改进及其测试方法的研究-材料科学专业论文.docxVIP

华中科技大学硕士学位论文 华 中 科 技 大 学 硕 士 学 位 论 文 II II ABSTRACT SMT(Surface Mounted Technology) is the most popular technology in electronic packaging and assembly at the present time. Solder paste is significant material in SMT, while solder paste print is a critical point in product yield in a SMT line. The proportion of the defects which are caused by solder paste print is 65?, so the products which are made in SMT lines are affected by solder paste print property directly and greatly. At presents, there are no equipments or instruments only used to test the performance of solder paste printability, mo