电子枪运输包装性能仿真分析-包天装工程专业毕业论文.pdf.docxVIP

摘 摘 要 T itlG : S IM U L A T IO N A N A L Y S IS O F E L E C T R O N G U N T R A N S P O R T p A C K A G IN G P E R F O R M A N C E M aj o r: P a e k a g in g E n g in e e rin g N a m e : Ya n g Z h a n g signature:乌 业 夕 S U P 6 四 IS O r : A s s o e ia te P ro f. Ya n fo n g G u o s ig nature:一色 经 ‘ In s tru e to r H o n g ta o W a n g A n S W G r D a te : M a rc h ，2 0 0 9 s’gna，u『e退今 ~ A b s tra C t E le e tro n g un 15 an irr e g u lar ly 一sh :甲 e d a n d fr a g ile e le e tro n ie s P ro d u c t m a d e o f v ari o u s m ateri als，wh ich 15 h igh ly d em an d ed fo r P roteetiv e P aek ag in g . T h is P ap er stu d ies th e eleetr on g u n C u shi o n in g stru e tu re an d u se o f (:o m P ut e r s im u lat io n te e hn o lo g y re s e ar e h a n d an a ly sis o f th e eleetro n gU n ’5 d yn am ies o f tran sP ort P ack agi n g . (l) A eeo rd in g to th e im P act o f P aek agin g m at eri als，an ti一v ib rat io n eh ar ac teri sties an d m eth o d o f eu sh io n in g P aek ag in g d esign ，th e eleetro n gu n tra n sP ort P aek agi n g requ irem 即 ts are an alyZ ed ，an d thr ee eleetro n gu n s C u sh io n in g P ro gr am S are P ro P o sed an d d esign ed (su ch as E P E fo am stru et--U re ，P u lP m o ld in g stru etu re ，eard b o ard b raek et stru ctu re). (2 ) An alyz e th e eu sh ion in g o f th e eleetro n gu n to v ib ratio n an d im P ac t resP on se，th e d 邓 am ic e q u a tio n s are d eri v e d u sin g L ap la e e tran sfo rm fo r so lv in g th e tran s fer fu n e tio n . (3)B y th e u se o f eo m P u ter sim u lat ion teehn o lo gy， th e eleetr on gu n d 扣 am ies o f tran sP ort P a e k a g in g a re re se a rc h e d an d an a l邓 ed . U n d er th e e le e tro n gu n d 扣 am ie s m o d e l，th e b lo c k d ia gr am o f th e e le e tr o n g u n ’5 tra