芯片制造流程演示幻灯片.pptVIP

Chip Manufacturing Overview 芯片制作概述 晶柱 Silicon Ingot 晶圆 Wafer 光罩制作 / 光刻 离子植入 切割、封装 电镀 (Die, 晶粒 ) (Chip, 晶芯 ) 蚀刻 Mask Making/ Photolithography Ion Implantation AssemblyTesting Electroplating Etching 沉积 Deposition 1 2 To make wafers, polycrystalline silicon is melted. The melted silicon is used to grow silicon crystals (or ingots) that are sliced into wafers. 首先融化多晶硅，生成晶柱，然后切割成 晶圆。 Raw Material for Wafers 晶圆制作所需原料 3 To remove the tiniest scratches and impurities, one side of each wafer is polished to a mirror-like surface. Chips are built on this surface. 切下的晶圆要经过清洁、磨光等步骤以去 除杂质，使平面光滑。