SMT PCBA 检验作业指导书 中英版.docx

PCBA inspection instruction PCBA 检验作业指导书  PURPOSE:目的 Define the PCBA inspection criterion to guide all station inspection operators and ensure the inspected PCBA meets customer requirements. 定义PCBA检验标准，为所涉及的各个工序检验人员等提供检验依据和判定标准，确保经过检验的PCBA符合客户要求。 SCOPE:范围 Applicable to all PCBA inspection station forXX project, such as VMI after reflow、X-Ray、Underfill、Globtop 、VMI、QA etc. 适用于XX项目所有PCBA检验岗位，如SMT炉后目检、X-Ray、Underfill、Globtop 、终检、QA等。 三、INSPECTION CONDITION检验条件 3.1 VMI inspection condition 外观检验条件 3.1.1 Inspection distance: 40cm from eye 3.1.2 Inspection angle: slant 45-90° 3.1.3 Inspection time: ≥5 second 3.1.4 Inspection environment: Under a 40W fluorescent lamp at a distance of 50cm from the observation object 观察距离: 离人眼40cm 观察角度: 在检查过程中将观测面旋转45到90度 观察时间: 大于或等于5秒 观察环境: 距离观测物50cm处的40W日光灯下 3.2 EQUIPMENT AND TOOLS:检验工具 Calipers：游标卡尺 Inspection microscope：检验显微镜 3.3 Sampling method:抽样方法 QA sampling plan QA抽样计划： NPI 试产品：100% inspection, 0 Accept and 1 Reject 全检，0收1退 MP 量产品：AQL=0.4，C=0 （See APPENDIX F:C=0 Sampling plan table 见附件F：零缺陷抽样计划表） Defect category缺陷分类Base on the affection to production, the defect is divided into 3 levels: critical defect, major defect, Minor defect. 依据对产品的影响程度。缺陷分为三类：致命缺陷，严重缺陷，轻微缺陷。 Defect define缺陷定义 Critical defect(CR): The defect may effective the safety of production or cause the main function failure. Major defect (MA): The defect may cause product function failure or degrade performance or effective product cosmetic. Minor defect (MI ): Any defect neither meet acceptable specification nor will seriously effective product performance cosmetic.致命缺陷（CR）：可能影响产品的安全使用或导致产品主要性能失效的缺陷。严重缺陷（MA）：可能导致产品性能失效或降低性能或影响产品形象的缺陷。轻微缺陷（MI）：任何不符合既定要求又不严重影响产品外观或性能的缺陷。 Inspection Magnification：放大检验 1).Visual inspection for PCBA shall be conductedunder10X microscope. If the acceptable condition of suspected defect is not apparent, it should be verified at progressively higher magnification (up to 30X) to confirm if it’s a defect 用10X显