大学英语 阅读材料Layer-by-Layer Assembly of Nanowires for Three-Dimensional, Multifunctional Electronics.pdfVIP

NANO

LETTERS

Layer-by-LayerAssemblyofNanowires2007

Vol.7,No.3

forThree-Dimensional,Multifunctional773777

Electronics

AliJavey,†,‡,,⊥SungWooNam,§,⊥RobinS.Friedman,†HaoYan,†and

CharlesM.Lieber*,†,§

DepartmentofChemistryandChemicalBiology,HarardUniersity,

Cambridge,Massachusetts02138,SocietyofFellows,HarardUniersity,

Cambridge,Massachusetts02138,andDiisionofEngineeringandAppliedSciences,

HarardUniersity,Cambridge,Massachusetts02138

ReceivedDecember27,2006;RevisedManuscriptReceivedJanuary15,2007

ABSTRACT

Wereportageneralapproachforthree-dimensional(3D)multifunctionalelectronicsbasedonthelayer-by-layerassemblyofnanowire(NW)

buildingblocks.Usinggermanium/silicon(Ge/Si)core/shellNWsasarepresentativeexample,tenverticallystackedlayersofmulti-NWfield-

effecttransistors(FETs)werefabricated.TransportmeasurementsdemonstratethattheGe/SiNWFETshavereproduciblehigh-performance

devicecharacteristicswithinagivendevicelayer,thattheFETcharacteristicsarenotaffectedbysequentialstacking,andimportantly,that

uniformperformanceisachievedinsequentiallayers1through10ofthe3Dstructure.Five-layersingle-NWFETstructureswerealsoprepared

byprintingGe/SiNWsfromlowerdensitygrowthsubstrates,andtransportmeasure