含乙二胺的深共熔溶剂中电沉积铜薄膜的微观结构与腐蚀性能研究.docVIP

  Electrodeposition, structural, and corrosion properties of Cu films from a stable deep eutectics system with additive of  5 10 ethylene diamine# Gu Changdong, You Yihui, Wang Xiuli, Tu Jiangping* (Department of Materials Science and Engineering, Zhejiang University, HangZhou 310025) Abstract: A comparative study was carried out on the deposition mechanism, microstructure, and corrosion resistance of Cu films electrodeposited from the base electrolyte of CuCl2·2H2O in a choline chloride ─ethylene glycol eutectic solvent with absence and presence of the additive of ethylene diamine (EDA). The base electrolyte is unstable and produces rough Cu films with columnar grains. Upon the introduction of EDA, the modified electrolyte becomes stable and the nucleation of Cu deposits is strongly inhibited, thus producing a smooth and compact surface with finer grains. Uniform corrosion and decreased corrosion current density are recognized in the fine grained Cu films. Keywords: Electrodeposition; Ionic liquids; Copper; Additive; Corrosion resistance 15 0 Introduction Electrodeposition of copper is widely adopted in the electronics industry for production of printed circuit boards, selective case hardening of steel for engineering components, and production of electrotypes in the printing industry due to its lower electrical resistivity compared 20 25 30 35 40 to aluminum and decorative appearance [1-4]. Particularly, copper can act as a protective layer to magnesium alloys and zinc alloy die-castings to allow further coatings to be applied [1, 5]. Moreover, as the grain size reduces into the nanometer range, metals usually exhibit peculiar and interesting mechanical and physical properties, e.g. increased mechanical strength, enhanced diffusivity, and higher specific heat compared to conventional coarse grained counterparts [6, 7]. Interestingly, when the grain size is characterized by a bimodal grain size distribution, i. e. with micrometre-sized grains embedded insid