电力电子集成模块用冷板传热性能的仿真与实验研究.pdfVIP

电力电子集成模块用冷板传热性能的仿真 与实验研究 Simulation and Experimental Research on Cold Plates Used for Integrated Power Electronics Module 西安交通大学能源与动力工程学院,余小玲，张荣婷，冯全科 Email：xlingyu@mail.xjtu.edu.cn 摘要：本文提出了水道结构分别为 S 型加分流片和螺旋型加分流片的两种新型冷板，并对这 两种新型冷板以及传统直线型和 S 型冷板的流场和温度场进行了仿真研究,对比了四种冷板的流 阻性能和换热性能。仿真结果表明, S 型加分流片冷板具有较好的流动换热综合性能，在相同的 进口流速和进口温度下，S 型加分流片冷板上芯片的最高温度比直线型冷板上的芯片温度低 19 ℃，比 S 型冷板上芯片的温度低 23℃。另外，本文对 S 型加分流片冷板的传热性能进行了实验 测试以对仿真结果进行验证，结果表明，仿真结果与实验结果的误差在 15%左右。 Abstract ：This paper presents two new type cold plates, whose liquid passages are respectively S-shape with fins and screw shape with fins. The temperature and flow fields of the two new cold plates, the current straight-line passage cold plate and S-shape passage cold plate were simulated and compared when they were used for integrated power electronics module (IPEM). The results indicated that the cold plate with liquid passage of S-shape with fins has the best flow and thermal performance in the four cold plates. The highest temperature of chips on it is 19℃ lower than that of the chip on the straight-line passage cold plate and 23 ℃ lower than that of chip on the S-shape passage cold plate, when the inlet velocity and temperature are the same. The flow and thermal performance of the cold plate with liquid passage of S-shape with fins were also tested in experiments to verify the simulated results. Error of the simulated results is about 15%. 关键词：冷板，电力电子集成模块，传热性能，流动阻力 Keywords ：Cold plate, Integrated power electronics module, Heat transfer performance, Flow resistance 循环需求水量大和各个流道流量分配不 1 前言 均的问题。国内外的研究主要集中在冷板 目前，风冷是电力电子装置中最常用 水道尺寸的优化上[1,2,3] 。和直线型水道相 的冷却方式。虽然风冷方式成本低廉，且 比，S 型水道结构节省进水量，流道的方 风冷技术不断提高，