在半导体产品的故障隔离-工艺-物理和封装失效分析的重要性和概述.pdfVIP

Microelectronics Reliability 51 (2011) 1440–1448 Contents lists available at ScienceDirect Microelectronics Reliability journal homepage: /lo cate/microrel Fault isolation in semiconductor product, process, physical and package failure analysis: Importance and overview Jiann Min Chin ⇑, Vinod Narang, Xiaole Zhao, Meng Yeow Tay, Angeline Phoa, Venkat Ravikumar, Lwin Hnin Ei, Soon Huat Lim, Chea Wei Teo, Syahirah Zulkifli, Mei Chyn Ong, Ming Chuan Tan Advanced Micro Devices Singapore, 508 Chai Chee Lane, Singapore 469032, Singapore a r t i c l e i n f o a b s t r a c t Article history: Failure analysis plays a major role in all areas of the semiconductor company especially during product Received 29 June 2011 development cycle, 1st silicon stage, or in wafer processes and fabrication as well as assembly and pack- Accepted 30 June 2011 age development. Different companies have different FA flows but all FA steps will need to start with fault Available online 9 August 2011 isolation. Fault isolation is the step to narrow down the focus area of a failing component or product to a manageable area that will allow us to (a) improve success of finding the defect that is causing the failure and, (b) significant speed up turn-around time for analysis. This paper provides an overview of all the available failure analysis on fault isolation methodologies