一种超厚铜板制作工艺探讨.pdfVIP

印制电路信息 2013 No.4 特种印制板 Special PCB 一种超厚铜板制作工艺探讨 Paper Code: S-101 何新荣 曾 平 黄贤权 （深圳市景旺电子股份有限公司， 广东 深圳 518102） 摘 要 通常铜厚≥350 m(10 oz)以上电路板称为超厚铜板,其主要应用于大电流大功率电源、 m 清洁能源太阳能等产品。随着这类产品需求量的迅速增长，未来超厚铜板必然会成为 PCB发展的另一趋势之一。超厚铜板由于铜厚较厚，制作时内层无铜区填胶、钻孔、蚀 刻等工序都存在一定的难度。文章通过制开发28 oz的超厚铜板，对选用的材料及制作 工艺等方面进行优化，解决了这类板制作过程中蚀刻、压合、钻孔等工序的制作难点， 为业内同行制作此类超厚铜板提供参考。 关键词 超厚铜；压合；钻孔；蚀刻；难点 中图分类号：TN41 文献标识码： A 文章编号：1009-0096（2014）04-0175-03 Discussion on production process of ultra thick copper PCB HE Xin-rong ZENG Ping HUANG Xian-quan Abstract Ultra thick copper board, which copper thickness is more than or equal to 350μm,and is mainly used in high current power supply, clean energy products. With the rapid growth demand of this kind of product, Ultra thick copper will become one trend of PCB development in future. For heavy copper, there are some difficulties in filling the inner copper free area, drilling, etching processes. This paper, we producted a 980μm(28oz)ultra thick copper board and finally solved the fabrication difficulties in etching, lamination and drilling process through the method of optimizing the selection of materials and production process, provide a reference for industry peer processing this kind of ultra thick copper board. Key words Ultra Thick Copper; Lamination; Drilling; Etching; Difficulties 1 前言 场前景，以及品牌客户需求，我公司对超厚铜多层印 制板产品进行技术难题攻关并实现超厚铜多层印制板 超厚铜多层印制板是一种特殊类的印制电路板， 产业化。本文介绍一款超厚铜四层印制板的关键生产 此类印制电路