The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering.pdfVIP

The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering.pdf

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The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering.pdf

Thin Solid Films 616 (2016) 820–827 Contents lists available at ScienceDirect Thin Solid Films journal homepage: /locate/tsf The multi-functional stack design of a molybdenum back contact prepared by pulsed DC magnetron sputtering Yunxiang Huang a,1, Shoushuai Gao b,1, Yong Tang a,?, Jianping Ao b,?, Wei Yuan a, Longsheng Lu a a Key Laboratory of Surface Functional Structure Manufacturing of Guangdong Higher Education Institutes, South China University of Technology, Guangzhou 510640, China b Institute of Photoelectronic Thin Film Devices and Technology, NanKai University, Tianjin 300071, China article info Article history: Received 24 June 2015 Received in revised form 27 September 2016 Accepted 30 September 2016 Available online 3 October 2016 Keywords: Mo back contact DC-pulsed sputtering Film stress Microstructure Multi-functional stack Adhesion abstract The purpose of this work is to study the effect of deposition parameters on the properties of molybdenum (Mo) ?lms based on direct-current (DC) pulsed magnetron sputtering and to develop a suitable Mo back contact structure with the requisite properties for Cu(In, Ga)Se2 (CIGS) thin ?lms fabricated by post-selenization of electrodeposited Cu/In/Ga stack precursors. The electrical, microstructural and stress properties of the Mo ?lms were investigated as a function of two deposition parameters: the working pressure and ?lm thickness. First, the resistivity of the Mo ?lms decreased with decreasing working pressure or increasing ?lm thickness. Second, the ?lms deposited at higher pressures with porous microstructures are under compressive stress, whereas those ?lms deposited at lower pressures with densely packed networks are under tensile stress. Third, the ?lms deposited at low pressure beyond a certain thickness exhibit tensile stress cracks. Given the above results, a multi-functional stack of Mo ?lms was introduced as the back contact. In this process, it was determined that a bilayer Mo back contact with oppo

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