Announcement and Call for Abstracts Topical （公告,并呼吁摘要局部）.pdf

Announcement and Call for Abstracts Topical Workshop on Flip Chip, Wafer Level Packaging Fan-Out This workshop is being held as a part of the Device Packaging Conference WeKoPa Resort Casino Fountain Hills, Arizona - USA March 15 - 17, 2016 Technical Co-Chair: Technical Co-Chair: Jon Aday, Qualcomm John Hunt, ASE US Eric Huenger, DOW jaday@ John.Hunt@ ehuenger@ Flip Chip, Wafer Level Packaging Fan-Out Organizing Committee: Linda Bal, TechSearch International Scott Hayes, FREESCALE ADDITIONAL COMMITTEE ADDED SOON Gilles Poupon, LETI Flip Chip, Wafer Level Packaging Fan-Out Workshop Focus: The objective of the FC WLP Workshop is to have a unique forum that brings together scientists, engineers, and business professionals from commercial and RD sectors around the world to discuss the most recent developments in flip chip and wafer level packaging technology. This workshop has been specifically organized to allow for the presentation and debate of all aspects of flip chip and wafer level packaging in an environment that encourages interaction and discussion among the participants . Abstracts are being requested on the following topics:  Wafer Level Materials and Processes including: o Substrates, Lids, and Lid Attach o Bumping: Cu Pillar, Pb-Free, micro bumps Fine Pitch o Capillary molded underfill, Non Conductive Paste/film o Redistribution and Repass