毕业论文（设计）金锡真空共晶焊仿真分析.docVIP

摘 要 共晶焊是微电子组装技术中的一种重要焊接工艺，在混合集成电路中彰显出了较重要的地位。芯片、焊片、基板共晶焊接后，由于芯片、焊片以及基板的热膨胀系数不相同而导致焊片内部产生热应力，甚至导致焊接失效，因此焊片焊接冷却后的应力分析是焊片可靠性预测的基础。 本文首先对芯片、焊片、基板共晶焊接后，冷却的热应力进行了仿真分析，运用ANSYS有限元软件，分别分析焊片厚度、基板厚度、芯片厚度、对流系数和冷却温度对应力的影响；其次针对影响共晶焊接冷却应力的五个因素，建立了三水平五因子的正交试验表，共18个组合，并对各因素因子组合进行了仿真分析，得到了各因素对共晶焊接冷却应力影响的程度和顺序。所得结果对焊片、基板、芯片厚度对共晶焊冷却应力的影响提供理论依据，对各工艺参数及尺寸参数的选择具有一定指导意义，具有一定的工程应用价值。 关键词：共晶焊；仿真分析；正交试验；应力 Simulated analysis of vacuum AuSn eutectic solder welding Student:Taibai-Zhu Teacher: Xiaoyong-Chen Xuanjun-Dai Abstract:Eutectic solder is an important welding process in microelectronics assembly technology, highlighted in the hybrid integrated circuit more important position. After soldering,because of chip, welding，substrate，thermal expansion coefficient’s different ，welding thermal stress is generated, and even lead to welding failure, so the stress of the weld after welding cooling analysis is the basis of the welding piece of reliability prediction. This paper research the chip, welding pieces, substrate eutectic after welding, the thermal stress of cooling simulation analysis, the finite element software ANSYS, respectively analyzing welding slice thickness, substrate thickness, chip thickness, convection coefficient and the cooling temperature effect on the stress; Secondly according to the five factors influencing the eutectic welding stress of cooling, the establishment of a three level five factor orthogonal test table, a total of 18 combinations, and factor combination of various factors on the simulation analysis, obtained the impact of various factors on the eutectic welding cooling stress degree and order. Results on welding , substrate, chip thickness of eutectic welding cooling stress provide theoretical basis for the influence of the various process parameters and the selection of size parameters have certain guiding significance, has certain engineering application value. Key words:eutectic;simulated analysis;orthogonal test table;stress 目 录 摘 要 I 1绪论 1 1.1研究的目的和