加成型有机硅导热灌封胶的制备与性能分析-preparation and performance analysis of addition molding silicone heat conductive potting compound.docxVIP

填料高。讨论SiCw、CNT对有机硅灌封胶导热性能的影响，当SiCw用量为填料总量的12Vol.%时，灌封胶的热导率从0.473W/(m·K)提高到0.577W/(m·K)，提高了22%；当CNT添加量为0.38Vol.%时，灌封胶热导率为0.525W/(m·K)，比未加碳纳米管时提高了10%。从SEM图中可以看出二者在基体中均分散较均匀，力学性能都比未添加时有较大提高，另一方面，CNT是电的良好导体，因添加量不高，使得有机硅灌封胶复合材料的体积电阻率虽下降，但复合材料的绝缘性能仍较好。灌封胶复合材料的热稳定性能优于纯的硅橡胶的热稳定性，且随着填料填充体积分数的增加，复合材料的热稳定性能也越好。关键词：加成型；导热灌封胶；氧化铝；碳化硅粉末；碳化硅晶须；碳纳米管AbstractWiththerapiddevelopmentofelectronictechnologyandelectronicindustry,electroniccomponentstendtobesmallerandsmaller,ofwhichtheheatdissipationwillaffecttheservicelifeoftheinstrumentandthestabilityofperformance.Therefore,thethermalconductivepolymercompositematerialshaveattractedtheattentionofagreatmanypeople.Thethermalconductivityofthepolymermaterialitselfisbad,bychangingthemolecularstructuretoimprovethethermalconductivityofthepolymercompositematerialsisdifficultandthecostishigh.So,atpresent,thethermalconductivityofthepolymermaterialsisimprovedbothathomeandabroadmainlythroughfillingmodification,addinginorganicfillerofhighthermalconductivity.Moistureproof,dustproof.shockproof,andgoodinheatresistance,electronicpouringsealantpouringsealantiswidelyusedintheelectronicsindustry.Intheprocessofthistopicresearch,takingvinylsiliconeoilasmatrix,orga-nohydrogenpolysiloxaneascrosslinkingagent,chloroplatinicacid-V4ascatalystandSiC,Al2O3,SiCw,CNTasthermalconductivefiller,bycontrollingthecontentandtheparticlesizedistributionofthefillerandaddingfibroushighthermalconductivityfillertoimprovetheperformanceofthermalconductivityofpouringsealant,weproducedcompositeofmoldingliquidpouringsealantofthermalconductivity.Throughthematerialthermalconductivity,viscosity,scanningelectronmicroscopy(SEM),volumeresistivity,dielectricconstant,thermalstability,mechanicalproperties,characterizationandanalysisinthethermalconductivity,thedispersioninthematrix,electricalinsulatingproperties,mechanicalpropertiesandthermalstabilityweretested.Theresultsshowedthat:WhenSiCandAl2O3arethethermalconductivefillers,withtheincreaseofSiCandAl2O3,thethermalconductivityofsiliconeencapsulan