软硬结合板(中英文).pdf

• 一种软硬结合覆铜板的制作方法 一种软硬结合覆铜板的制作方法 一种软硬结合覆铜板的制作方法一种软硬结合覆铜板的制作方法 A method of making copper plate with soft and hard A method of making copper plate with soft and hard A method of making copper plate with soft and hard A method of making copper plate with soft and hard combination. combination. bination. • 技术领域 Technical field • [0001] 本发明涉及 PCB 软硬结合板制造领域，具体涉及到线路板厂或者覆铜板厂制造出软硬结合覆铜板的 方法。 [0001] the invention relates to the manufacturing field of PCB soft and hard binding plate, which is specifically related to the method of manufacturing soft and hard combined copper plates in the circuit board factory or copper plate factory. • 背景技术 Technical background • [0002] 软硬结合电路板是指在一块印制板上包含有一个或多个刚性区和一个或多个软性区的电路板。 [0002] soft and hard binding circuit boards refer to a printed board containing one or more rigid areas and one or more flexible circuit boards. • [0003] 软板的材料一般选用聚酰亚胺（PI）软性基材，聚酰亚胺是一种具有很好的可软性，优良的电气性 能和耐热的材料，但它具有较大的吸湿性和不耐强碱性。 [0003] soft plate material polyimide (PI) is generally selected soft base material, polyimide is a very good soft, excellent electrical properties and heat resistant material, but it has large hygroscopicity and not resistant to strong alkali. • [0004] 刚性板的材料一般选用环氧树脂玻璃纤维布基材 FR-4。 [0004] the material of rigid plate is usually made of epoxy resin glass fiber cloth substrate fr-4. • [0005] 一般的软硬结合板是先采用柔性覆铜板（FCCL）制作软板，然后把软板加入到硬板中制作出软硬结 合板。 [0005] the general soft and hard binding plate is made of flexible copper plate (FCCL), and then the soft board is added to the hard plate to make the soft and hard board. • [0006] 软板部分起到软连接（可以弯曲）的作用，硬板部分起到安装电子元器件的作用，软板部分是镂空 的。 [0006] the soft board part plays the role of soft connection (bending). The hard board part ACTS as an electronic component, and the soft plate is hollow. • [0007] 软板材料和硬板材料因为材料特性的不同，在加工时需要特别对待，例如：化学铜不容易沉积到 PI