基于虚拟仪器的微小参数测试方法及系统分析-test method and system analysis of micro parameters based on virtual instrument.docxVIP

AbstractAbstractWith the development of electronic technology, the integration of electronic products are more and more high, the requirement of people about product performance, power consumption and cost are becoming more and more high. The packaging technology of SIP(System In Package, SIP) that high integration, low cost, high reliability, is once again leap development of the semiconductor industry. Stack system level packaging technology, three-dimensional integrated circuits (3D-IC) using through silicon via hole (through silicon via, TSV) technology to realize the circuit on the vertical interconnect, can largely reduce the length of the interconnect, reducing power consumption. But the TSV technology is quite complicated, can produce a defect in the production process, affect the integrity and reliability of signal transmission. If defects can lead to TSV signal transmission failure, will cause the entire package chip does not work. In order to avoid the malfunction is the whole package chip does not work, the TSV testing is particularly important.This paper studied a TSV fault test method of short circuit and open circuit fault detection TSV. This method using virtual instrument for signal acquisition and virtual instrument is to establish test and control system with the aid of computer hardware and software platform, can design their own instrument system according to user needs, can meet the demand of all kinds of social applications. Is the LabVIEW virtual instrument programming language, it uses the G language programming, friendly interface, can very good complete data acquisition, processing and storage, and other functions. Due to the 3 d integration is very high, using vertical interconnection of TSV, so the fabrication of TSV also requires a high degree of. TSV fabrication requirements is fairly small, so will have a part in the process of signal transmission noise. In order to be able to extract data to determine correct TSV fault condition, thi