铝硅与铝碳纤维封装材料的热压制备及性能分析-hot pressing preparation and performance analysis of aluminum-silicon and aluminum-carbon fiber packaging materials.docxVIP

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2018-07-27 发布于上海
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铝硅与铝碳纤维封装材料的热压制备及性能分析-hot pressing preparation and performance analysis of aluminum-silicon and aluminum-carbon fiber packaging materials.docx

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铝硅与铝碳纤维封装材料的热压制备及性能分析-hot pressing preparation and performance analysis of aluminum-silicon and aluminum-carbon fiber packaging materials

ABSTRACTPreparationandCharacterizationofSiAlandAl/CfElectronicPackagingMaterialsbyHot-pressingProcessWiththedevelopmentofelectroniccomponentsandthepackagingtechnology,higherrequestsareputforwardforthecorrespondingelectronicpackagingmaterials.Si-AlalloysandAl/Cfcompositematerialsnotonlyhavethehighheatconductivity,lowthermalexpansioncoefficientsimilarwiththechipmaterial(silicon,galliumarsenide),butalsolowdensity.Thecompositematerialshaveagoodapplicationprospectinthefieldofelectronicpackagingmaterials.Inthisdissertation,siliconaluminumalloyswerestudiedsystematically,andseveralinfluencingfactorshavebeeninvestigatedfortheperformanceofthealuminumalloy,suchasthesiliconcontent,theprocessofhotisostaticpressingandsintering.Byanalyzingthedensityofthealloy,thermalproperties,mechanicalproperties,X-raydiffractionpatternsandsectionsscanningimages,wecangetthefollowingconclusions:Byincreasingthesiliconcontents,thedensityandthethermalexpansioncoefficientofsiliconaluminumalloysgraduallydecrease,whilethethermalconductivityincreases.Thechangesofbendingstrengthandhardnessmainlyreflectthemechanicalperformance.Withtheincreaseofsiliconcontent,thebendingstrengthofsiliconaluminumalloysbecomingsmaller,butthehardnesslargelyincreases.Bytheanalysisoftestdata,wefoundthattheperformanceofthe50%SiAlalloycanmeetthepracticalelectronicpackagingneeds.Althoughsiliconcontentmorethan50%woulddecreasethedensityofalloyandgainbetterperformance,consideringthedifficultyandcostsofpreparation,wefocusedthe50%SiAlalloy.Siliconaluminumalloysinteredviahotisostaticpressingprocess,thedensity,thermalexpansioncoefficientandthermalconductivityallincreased,andthebendingstrengthandhardnessarealsolargelyimproved.Whenstudyingthealloysinteringprocess,wefoundthatbestsinteringparametersof50%oftheSiAlalloywassintered2hoursat800℃,100MPa.therelativedensityofthealloyreached99%,coefficientofthermalexpansionis9.3×10-6/K,thethermalconductivityis142W/m·K,thebendingstrengthis223MPa,andthehardnessis153HB.Inaddition,wealsostudiedanotherkindo