电子封装快速热疲劳可靠性的分析-材料加工工程专业论文.docxVIP

华中科技大学硕士学位论文 华 中 科 技 大 学 硕 士 学 位 论 文 II II Abstract Thermal fatigue is a critical reliability issue which would bring failure to electronic components. The standard of thermal cycling test has been widely used among electronic industry or independent institutes to conduct research. The equipment for this test is temperature chamber and which is capable of heating and cooling the objects in it following given temperature profile. And the time for one cycle ranges from 15min to 2h, which is too time-consuming. In order to fix the shortage of the traditional thermal cycling test, a new testing method namely fast thermal fatigue test has been proposed here. And a fast thermal fatigue testing machine has been built based this idea. The final operation result indicates that the machine is capable of heating the sample temperature to 200oC within 10s, and cooling it to desired temperature within 10s as well. In the common thermal cycling tests, the primary solder damage mechanism is the interaction of creep and thermal-mechanical fatigue which is caused by the CTE (coefficient of thermal expansion) mismatch between different layers. However, so far there is no reported research focused in the metallurgical vibrations of solder joints (such as grain size of solder, the structure and distribution of IMC) in the process of thermal cycling without the effect of thermal stress. So the idea of this paper is to test the solder which is reflowed on pad without components. The customized Sn3.0Ag0.5Cu/Cu solder joints are tested on the fast thermal fatigue machine. The results indicated that IMC between the interface of solder and pad would grow gradually during the test, and the grow rate is faster under a higher temperature condition. The grow rate is also linearly related to the accumulated heating preservation time. The test result provides new possibilities to modify the thermal cycling temperature profile. The impact of fast thermal fatigue on the reliability of light emitting