电子连接器超声波真空清洗技术的分析-机械工程专业论文.docxVIP

华 中 科 技 大 学 硕 士 学 位 论 文 华 中 科 技 大 学 硕 士 学 位 论 文  PAGE 4 III Abstract With the rapid development of the electronic products, the high precision, high level of integration, quality and reliability of the products are more and more required. The cleanness of electronic parts is one of the important factors affecting the product quality eventually, so almost all electronic products are to be cleaned to remove the surface dirt before assembly. The electronic connectors are indispensable components of electronic products. its surface dirt will influence the signal transmission of the circuit and led to final product failure, so the cleaning of electronic connectors is an important process to ensure the quality of electronic products. In this thesis, on the basis of the electronic connectors cleaning requirement, electronic connector ultrasonic vacuum cleaning technology and equipment is researched preliminarily. According to the cleaning characteristics of electronic connectors, ultrasonic vacuum cleaning method is selected, The preliminary study of the principle of the ultrasonic vacuum cleaning and a simple analysis of the basic structure for ultrasonic cleaning equipment are accomplished; Through the analysis of cleaning solution and cleaning pollutants, hydrocarbon solvent is decided to be used as cleaning solution; The ultrasonic vacuum thick cleaning, ultrasonic vacuum fine cleaning, steam cleaning and vacuum drying cleaning process are designed according to the electronic connector cleanness requirements; To ultrasonic cleaning process, this thesis analyzes the ultrasonic cleaning work frequency and power, cleaning solution temperature, cleaning time, other major technological parameters and cleaning process key points, and then points out the design requirements of the electronic connector ultrasonic vacuum cleaning equipment, determines the scheme of ultrasonic cleaning equipment, the pipeline, cleaning tub, material transmission equipment. Followi