晶圆切割-云林科技大学.PPT

Visualization of machine clustering for a Taiwanese IC packaging foundry IC Manufacture Flow Background─ The k-means algorithm 1. Given : {2,4,10,12,3,20,30,11,25} k=2 2. Randomly assign means : m1=3 ; m2=4 ? k1={2,3} , k2={4,10,12,20,30,11,25} ,m1=2.5 , m2=16 ? k1={2,3,4} , k2={10,12,20,30,11,25} , m1=3 , m2=18 ? k1={2,3,4,10} , k2={12,20,30,11,25} , m1=4.75 , m2=19.6 ? k1={2,3,4,10,11,12} , k2={20,30,25} , m1=7 , m2=25 ….. Background ─ SOM MST The data and results We collect 366 records of data from a Taiwanese foundry, and six attributes as follows: (1)Prod_Qty [20439.89] (2)Prod_Time [648.92] (3)Small_Stops [280.54] (4)Standby [123.21] (5)Change-over_Time [30.12] (6)Breakdowns [46.43] The data and results The data and results The data and results Conclusion Given the clusters obtained and taking advantage of a visualization, we plot centers of clusters using parallel coordinates that provide an easier outlook for managers to assign. The draw back remains because given the graphs we still need to find the original values to know more about the details. Advantage … Drawback … Application Other foundry * Intelligent Database Systems Lab N.Y.U.S.T. I. M. * Intelligent Database Systems Lab 國立雲林科技大學 National Yunlin University of Science and Technology Advisor : Dr. Hsu Presenter : Ai-Chen Liao Authors : Hsu-Hao Yang, He-Yau Kang Tzu-Chiang Liu 2007 . ESWA . Page(s) : 324 - 329 Outline Motivation Objective Background The k-means algorithm SOM MST The data and results Conclusion Personal Opinions IC後段製程 IC前段製程 晶圓製造 晶棒成長 切割 晶片製造 氧化 光罩校準 蝕刻 雜質擴散 離質植入 氣相沈積 晶片針測 光罩 光罩製作 IC設計 邏輯設計 線路設計 圖形設計 導線架 蝕刻沖壓 IC封裝 晶圓切割 黏晶 焊線 封膠 剪切成形 印字 檢測 IC測試 進料檢驗 晶片測試 外觀檢驗 烘烤 入庫檢驗 An IC packaging process IC 封裝的功能與目的 提供電氣傳導路徑(包括金線、Lead frame及銅導線)，讓微細的IC電路彼此做連結 保護IC晶片不受外力的破壞及避免溼氣滲透到IC內部