硅片切割班工艺讲义.pptVIP

硅片切割工艺讲义 制造二部 林青云 2006年3月 主要内容 1、车间流程的介绍 2、Squarer的介绍 3、Cropping Saw的介绍 4、Grinder的介绍 5、gluing Brick 的介绍 6、Wire Saw 7、Cleaning Station的介绍 1、车间流程的介绍 Building 1 Layout 2、SQUARER的介绍 3、Cropping Saw BAND SAW Slice usable length of brick by cropping top bottom Usable length of brick is determined by the Life time tester. Special diamond coated blade is used for cropping Blade rotates at constant speed. Mount the Brick Suitably on the Table Table moves at set speed to slice the brick SPECIFICATIONS BRICK PREPARATION Ingot is sliced into 16 pieces of 156x 156 x 220 mm size bricks. Top Bottom of Ingot has contaminations and has less Life time and hence to be cropped. BAND SAW(GT Supplied) Crops Top Bottom. Some time Brick Sizes may be higher than 125 x 125(Man or Machine error). Hence, surfaces needs to be grinded to required 125 x 125 mm. SURFACE GRINDER (GT Supplied) helps in Surface Grinding and to get right size bricks. As silicon is brittle and sharp edges are prone to cracks while Handling. CHAMFERING(GT Supplied) grind edges to avoid cracks during Brick Wafer handling BRICK PREPARATION Prepare bricks in such a way that usable in wire saw and Wafers are acceptable in Cell Line. 4、SURFACE GRINDER Grind the surfaces to match the specification of 156 x 156 mm cross section Uses Diamond coated Grinding Wheel 3 AXIS Machine Brick is mounted on Special a chuck. Special Diamond coated grinding Wheel grinds the surface WHY DIAMOND GRINDING WHEEL? PRINCIPLE Chuck with Brick moves, BACK FORTH in X axis at Constant speed Chuck also advances in Z direction at Every BACK or FORTH Limits. At the end of each Z Limit(Front Or Back), Grinding Wheel moves downward at configured distance. Number of step in Y axis(Grinding wheel) and Step Length is configured 5、Gluing Brick 7、WAFER CLEANING WAFER CLEANING HAS TWO STAGE Pre-Cleaning Beam, which contains sliced wafer is transferred to Pre cleaning station, where the 90% of slurry is cleaned