紫外激光多层FPC钻盲孔工艺改进研究.docVIP

分数： 评卷人： 研究生（光电技术概论）课程论文 题目：紫外激光多层FPC钻盲孔工艺改进研究 学 号姓 学 号 姓 名 专 业 课程指导教师 院（系、所） M201472200 纪明 唐霞辉 光电学院 2014年 12 月 17 日 紫外激光多层FPC钻盲孔工艺改进研究 摘 要：紫外激光由于波长短，聚焦光斑小，能量密度高，能直接熔化和蒸发 材料，无需采用其它方法就可直接对铜层和绝缘材料进行加工，因而相对于C02 激光加工具有工艺程序简单、流程短和效率高的优势，在薄型高密度的微孔板特别 是在叠层多芯片组件的高密度互连板和具有埋、盲孔结构的高密度互连多层板屮得 到广泛应用。利用紫外激光进行多层FPC钻盲孔的难点在于盲孔深度的控制和盲孔 底部表面绝缘材料完全去除一致性，釆用传统同心圆扫描或螺旋线扫描方法进行加 工在微盲孔中心区域容易出现绝缘材料去除不干净或者造成内层铜箔剥离等问题。 本文章为此提岀了创新的定点一同心圆扫描结合加工方式，解决了传统直接采用同 心圆扫描或螺旋线扫描钻盲孔加工方法屮盲孔底部表面高度不均匀的问题。 紫外激光FPC钻孔盲孔深度同心圆扫描 Abstract： UV laser, with the advantage of short wavelength, small focusing spot size as well as high energy density, can directly melt and evaporate materials, and processe on the copper layer and the insulating material with no need to use other methods. Thereforejt has the advantages of short process, simple procedure and high efficiency when compared with CO2 lasers. So the UV laser has been widely applicated in thin high density micropore plate especially in high density interconnection plate of laminated multi-chip module and high density interconnect multilayer board, blind hole buried in the structure.The difficulties of using UV laser to drill blind holes in multilayer FPC are cotrolling the depth of blind hole and consistency in complete removing the bottom of the blind hole surface insulation material. The traditional concentric scanning or spiral scanning processing method can easily prone to insulting material removal imperfectly or insulting problems such as inner layer copper foil peeling in processing the micro blind holes.Therefore, this artical innovatively put forward a point-concentric scanning combination processing method, to solve the problem of uneven surface height of blind hole buttom by using the traditional concentric scanning or spiral scanning to drill blind holes. Keywords： UV laser FPC drilling holes depth of blind hole concentric scanning 1、引言 随着电子产品向着小型化、轻型化和功能多样化以及高效化趋势不断发展，同 时半导体集成电路的集成度不断提高,速度不断加快，对PCB密度要求也不断提高, 使得PCB上的导线越来越细，微孔也越来越小。当印制板上需要大量直径小于 200^的小孔