六英寸晶圆片倒片系统的设计、分析与测试机械电子工程专业论文.docxVIP

哈尔滨工业大学工学硕士学位论文 哈尔滨工业大学工学硕士学位论文 - - II - Abstract With the development of the semiconductor industry, wafer, as the basic material of semiconductor, is used more and more widely. The wafer transfer system (WTS) is the special equipment in the wafer production line, and it is used for transferring wafers automatically. But the price of an input WTS is very expensive. So it is necessary to design a low cost, high reliability WTS for the industrial use. In this paper, the hardware system of WTS is successfully designed, including mechanical and control system. First of all, the system design is completed, including identification of technical requirements, mechanical design, control system design, system assembly. The mechanical design includes identification of structure scheme, concept design and sample design of 6-inch WTS. While the control system design includes identification of control scheme, selection of electrical components and circuit design. In the control system, PLC is used to control stepper driver, which can ensure the reliability of the system. Secondly, Computer Aided Engineering is applied to carry out verification, modeling and simulation anslysis of the implementation of WTS, including the three vertical motion working places and the gear system. It provides the oretical foundation for actual movements. According to the working situation, the functional modes of WTS are designed, and then the flow chart is summarized for the following control program. Finally, in the initial tests, reapeatability is analysised and the result is successful. When the control program is finished, repetitive testing and debugging can be done in final step. Keywords wafer transfer system, PLC, stepper motor, dynamatic model - - PAGE IV- 目录 摘要 I Abstract II 第 1 章 绪论 1 1.1 课题背景 1 1.2 本课题研究的目的及意义 1 1.3 国内外相关技术发展现状 2 1.3.1 晶圆片的发展现状 2 1.3.2 晶圆片倒片技术的发展概况 3 1.3.3 晶圆片倒片系统的工业应用和关键技术 6 1.4 本文主要研究内容 7 第 2 章 6 英寸晶圆片倒片系统原理方案设计与分析 8 2.1 引